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slls596b ? october 2003 ? revised june 2006 1 post office box 655303 ? dallas, texas 75265 esd protection for rs-232 i/o pins ? 15 kv ? human-body model (hbm) meets or exceeds the requirements of tia/eia-232-f and itu v.28 standards operates at 5-v v cc supply four drivers and four receivers operates up to 120 kbit/s external capacitors ...4 0.1 f latch-up performance exceeds 100 ma per jesd 78, class ii applications ? battery-powered systems, pdas, notebooks, laptops, palmtop pcs, and hand-held equipment description/ordering information the max208 device consists of four line drivers, four line receivers, and a dual charge-pump circuit with 15-kv hbm esd protection pin to pin (serial-port connection pins, including gnd). the device meets the requirements of tia/eia-232-f and provides the electrical interface between an asynchronous communication controller and the serial-port connector. the charge pump and four small external capacitors allow operation from a single 5-v supply. the devices operate at data signaling rates up to 120 kbit/s and a maximum of 30-v/ s driver output slew rate. ordering information t a package ? orderable part number top-side marking pdip (nt) tube of 15 max208cnt max208cnt soic (dw) tube of 25 max208cdw max208c 0 c to 70 c soic (dw) reel of 2000 max208cdwr max208c 0 c to 70 c ssop (db) tube of 60 max208cdb ma208c ssop (db) reel of 2000 max208cdbr ma208c pdip (nt) tube of 15 max208int max208int soic (dw) tube of 25 max208idw max208i ?40 c to 85 c soic (dw) reel of 2000 max208idwr max208i ?40 c to 85 c ssop (db) tube of 60 max208idb mb208i ssop (db) reel of 2000 max208idbr mb208i ? package drawings, standard packing quantities, thermal data, symbolization, and pcb design guidelines are available at www.ti.com/sc/package. copyright ? 2006, texas instruments incorporated please be aware that an important notice concerning avail ability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. db, dw, or nt package (top view) dout2 dout1 rin2 rout2 din1 rout1 rin1 gnd v cc c1+ v+ c1? dout3 rin3 rout3 din4 dout4 din3 din2 rout4 rin4 v? c2? c2+ 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13
slls596b ? october 2003 ? revised june 2006 2 post office box 655303 ? dallas, texas 75265 function tables each driver input d in output d out l h h l h = high level, l = low level each receiver input r in output r out l h h l open h h = high level, l = low level, open = input disconnected or connected driver off logic diagram (positive logic) rin2 rout2 din1 dout1 rin3 rout3 5 4 22 2 3 23 rin1 rout1 67 din2 dout2 din3 dout3 18 19 1 24 din4 dout4 21 20 rs-232 outputs ttl/cmos inputs rs-232 inputs ttl/cmos outputs rin4 rout4 17 16
slls596b ? october 2003 ? revised june 2006 3 post office box 655303 ? dallas, texas 75265 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) ? supply voltage range, v cc (see note 1) ?0.3 v to 6 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . positive charge pump voltage range, v+ (see note 1) v cc ? 0.3 v to 14 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . negative charge pump voltage range, v? (see note 1) ?14 v to 0.3 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . supply voltage difference, v+ ? v? (see note 1) 13 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . input voltage range, v i : drivers ?0.3 v to v+ + 0.3 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . receivers 30 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . output voltage range, v o : drivers v? ? 0.3 v to v+ + 0.3 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . receivers ?0.3 v to v cc + 0.3 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . short-circuit duration: d out continuous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . package thermal impedance, ja (see notes 2 and 3): db package 63 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . (see notes 2 and 3): dw package 46 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . (see notes 2 and 4): nt package 67 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . operating virtual junction temperature, t j 150 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . storage temperature range, t stg ?65 c to 150 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ? stresses beyond those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only, a nd functional operation of the device at these or any other conditions beyond those indicated under ?recommended operating conditi ons? is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. notes: 1. all voltages are with respect to network gnd. 2. maximum power dissipation is a function of t j (max), ja , and t a . the maximum allowable power dissipation at any allowable ambient temperature is p d = (t j (max) ? t a )/ ja . operating at the absolute maximum t j of 150 c can affect reliability. 3. the package thermal impedance is calculated in accordance with jesd 51-7. 4. the package thermal impedance is calculated in accordance with jesd 51-3. recommended operating conditions (see note 5 and figure 4) min nom max unit supply voltage 4.5 5 5.5 v v ih driver high-level input voltage d in 2 v v il driver low-level input voltage d in 0.8 v v i driver input voltage d in 0 5.5 v v i receiver input voltage ?30 30 v t a operating free-air temperature max208c 0 70 c t a operating free-air temperature max208i ?40 85 c note 5: test conditions are c1?c4 = 0.1 f at v cc = 5 v 0.5 v. electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see note 5 and figure 4) parameter test conditions min typ max unit i cc supply current no load, v cc = 5 v, t a = 25 c 11 20 ma note 5: test conditions are c1?c4 = 0.1 f at v cc = 5 v 0.5 v.
slls596b ? october 2003 ? revised june 2006 4 post office box 655303 ? dallas, texas 75265 driver section electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see note 5 and figure 4) parameter test conditions min typ max unit v oh high-level output voltage d out at r l = 3 k ? to gnd, d in = gnd 5 9 v v ol low-level output voltage d out at r l = 3 k ? to gnd, d in = v cc ?5 ?9 v i ih high-level input current v i = v cc 15 200 a i il low-level input current v i at 0 v ?15 ?200 a i os ? short-circuit output current v cc = 5.5 v, v o = 0 v 10 60 ma r o output resistance v cc , v+, and v? = 0 v, v o = 2 v 300 ? short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more t han one output should be shorted at a time. note 5: test conditions are c1?c4 = 0.1 f at v cc = 5 v 0.5 v. switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see note 5 and figure 4) parameter test conditions min typ ? max unit maximum data rate c l = 50 to 1000 pf, one d out switching, r l = 3 k ? to 7 k ? , see figure 1 120 kbit/s t plh (d) propagation delay time, low- to high-level output c l = 2500 pf, all drivers loaded, r l = 3 k ? , see figure 1 2 s t phl (d) propagation delay time, high- to low-level output c l = 2500 pf, all drivers loaded, r l = 3 k ? , see figure 1 2 s t sk(p) pulse skew c l = 150 pf to 2500 pf, see figure 2 r l = 3 k ? to 7 k ? , 300 ns sr(tr) slew rate, transition region (see figure 1) c l = 50 pf to 2500 pf, v cc = 5 v r l = 3 k ? to 7 k ? , 3 6 30 v/ s ? all typical values are at v cc = 5 v, and t a = 25 c. pulse skew is defined as |t plh ? t phl | of each channel of the same device. note 5: test conditions are c1?c4 = 0.1 f at v cc = 5 v 0.5 v. esd protection pin test conditions typ unit d out , r in human-body model 15 kv
slls596b ? october 2003 ? revised june 2006 5 post office box 655303 ? dallas, texas 75265 receiver section electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see note 5 and figure 4) parameter test conditions min typ max unit v oh high-level output voltage i oh = ?1 ma 3.5 v v ol low-level output voltage i ol = 1.6 ma 0.4 v v it+ positive-going input threshold voltage v cc = 5 v, t a = 25 c 1.7 2.4 v v it? negative-going input threshold voltage v cc = 5 v, t a = 25 c 0.8 1.2 v v hys input hysteresis (v it+ ? v it? ) v cc = 5 v 0.2 0.5 1 v r i input resistance v i = 3 v to 25 v, v cc = 5 v, t a = 25 c 3 5 7 k note 5: test conditions are c1?c4 = 0.1 f at v cc = 5 v 0.5 v. switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see note 5 and figure 3) parameter test conditions min typ ? max unit t plh (r) propagation delay time, low- to high-level output c l = 150 pf 0.5 10 s t phl (r) propagation delay time, high- to low-level output c l = 150 pf 0.5 10 s t sk(p) pulse skew ? 300 ns ? all typical values are at v cc = 5 v, and t a = 25 c. ? pulse skew is defined as |t plh ? t phl | of each channel of the same device. note 5: test conditions are c1?c4 = 0.1 f, at v cc = 5 v 0.5 v. parameter measurement information 50 ? test circuit voltage waveforms 0 v 3 v output input v ol v oh t plh (d) generator (see note b) r l rs-232 output t phl (d) c l (see note a) sr(tr) 6v t phl (d) or t plh (d) notes: a. c l includes probe and jig capacitance. b. the pulse generator has the following characteristics: prr = 120 kbit/s, z o = 50 ? , 50% duty cycle, t r 10 ns, t f 10 ns. 1.5 v 1.5 v 3 v ?3 v 3 v ?3 v figure 1. driver slew rate
slls596b ? october 2003 ? revised june 2006 6 post office box 655303 ? dallas, texas 75265 parameter measurement information test circuit voltage waveforms 0 v 3 v output input v ol v oh t plh (d) t phl (d) 50% 50% notes: a. c l includes probe and jig capacitance. b. the pulse generator has the following characteristics: prr = 120 kbit/s, z o = 50 ? , 50% duty cycle, t r 10 ns, t f 10 ns. 1.5 v 1.5 v 50 ? generator (see note b) r l rs-232 output c l (see note a) figure 2. driver pulse skew test circuit voltage waveforms 50 ? 50% 50% ?3 v 3 v 1.5 v 1.5 v output input v ol v oh t phl (r) generator (see note b) t plh (r) output c l (see note a) notes: a. c l includes probe and jig capacitance. b. the pulse generator has the following characteristics: z o = 50 ? , 50% duty cycle, t r 10 ns, t f 10 ns. figure 3. receiver propagation delay times
slls596b ? october 2003 ? revised june 2006 7 post office box 655303 ? dallas, texas 75265 application information dout2 1 + ? 400 k ? 5 v 18 din2 400 k ? 5 v 19 400 k ? 5 v 21 dout4 20 5 k ? 23 rout3 22 rin3 24 dout3 5 k ? 16 rout4 17 rin4 15 + ? 0.1 f 16v 14 13 + ? 0.1 f 16 v c2? c2+ dout1 2 rin1 7 400 k ? 5 v din1 5 rout1 6 rin2 3 5 k ? rout2 4 0.1 f 6.3v 12 11 v+ 10 + ? 0.1 f 6.3v 9 v cc + ? 0.1 f gnd 8 din3 din4 c1+ c1? v? 5 k ? notes: a. resistor values shown are nominal. b. non-polarized ceramic capacitors are acceptable. if polarized tantalum or electrolytic capacitors are used, they should be connected as shown. figure 4. typical operating circuit and capacitor values
slls596b ? october 2003 ? revised june 2006 8 post office box 655303 ? dallas, texas 75265 application information capacitor selection the capacitor type used for c1?c4 is not critical for proper operation. the max208 requires 0.1- f capacitors, although capacitors up to 10 f can be used without harm. ceramic dielectrics are suggested for the 0.1- f capacitors. when using the minimum recommended capacitor values, ensure that the capacitance value does not degrade excessively as the operating temperature varies. if in doubt, use capacitors with a larger (e.g., 2 ) nominal value. the capacitors? effective series resistance (esr), which usually rises at low temperatures, influences the amount of ripple on v + and v ? . use larger capacitors (up to 10 f) to reduce the output impedance at v + and v ? . bypass v cc to ground with at least 0.1 f. in applications sensitive to power-supply noise generated by the charge pumps, decouple v cc to ground with a capacitor the same size as (or larger than) the charge-pump capacitors (c1?c4). esd protection ti max208 devices have standard esd protection structures incorporated on the pins to protect against electrostatic discharges encountered during assembly and handling. in addition, the rs232 bus pins (driver outputs and receiver inputs) of these devices have an extra level of esd protection. advanced esd structures were designed to successfully protect these bus pins against esd discharge of 15 kv when powered down. esd test conditions esd testing is stringently performed by ti, based on various conditions and procedures. please contact ti for a reliability report that documents test setup, methodology, and results. human-body model (hbm) the hbm of esd testing is shown in figure 5, while figure 6 shows the current waveform that is generated during a discharge into a low impedance. the model consists of a 100-pf capacitor, charged to the esd voltage of concern and subsequently discharged into the dut through a 1.5-k ? resistor. ? + dut r d 1.5 k ? v hbm 100 pf c s figure 5. hbm esd test circuit
slls596b ? october 2003 ? revised june 2006 9 post office box 655303 ? dallas, texas 75265 application information 100 150 200 50 0 1.5 1.0 0.5 0.0 v hbm = 2 kv dut = 10 v, 1- ? zener diode time ? ns i dut ? a figure 6. typical hbm current waveform machine model (mm) the mm esd test applies to all pins using a 200-pf capacitor with no discharge resistance. the purpose of the mm test is to simulate possible esd conditions that can occur during the handling and assembly processes of manufacturing. in this case, esd protection is required for all pins, not just rs-232 pins. however, after pc board assembly, the mm test no longer is as pertinent to the rs-232 pins.
packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) max208cdb active ssop db 24 60 green (rohs & no sb/br) cu nipdau level-1-260c-unlim max208cdbg4 active ssop db 24 60 green (rohs & no sb/br) cu nipdau level-1-260c-unlim max208cdbr active ssop db 24 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim max208cdbrg4 active ssop db 24 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim max208cdw active soic dw 24 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim max208cdwe4 active soic dw 24 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim max208cdwr active soic dw 24 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim max208cdwre4 active soic dw 24 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim max208cnt preview pdip nt 24 15 tbd call ti call ti max208idb active ssop db 24 60 green (rohs & no sb/br) cu nipdau level-1-260c-unlim MAX208IDBE4 active ssop db 24 60 green (rohs & no sb/br) cu nipdau level-1-260c-unlim max208idbr active ssop db 24 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim max208idbre4 active ssop db 24 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim max208idw active soic dw 24 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim max208idwe4 active soic dw 24 25 green (rohs & no sb/br) cu nipdau level-1-260c-unlim max208idwr active soic dw 24 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim max208idwre4 active soic dw 24 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim max208int preview pdip nt 24 15 tbd call ti call ti (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. package option addendum www.ti.com 12-sep-2006 addendum-page 1
green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. package option addendum www.ti.com 12-sep-2006 addendum-page 2
mechanical data mpdi004 october 1994 post office box 655303 ? dallas, texas 75265 nt (r-pdip-t**) plastic dual-in-line package 4040050 / b 04/95 24 pins shown 1.425 (36,20) 1.385 0.295 (7,49) (8,00) 0.315 (35,18) 28 pins ** a min a max b max b min 13 0.250 (6,35) 0.280 (7,11) 12 0.200 (5,08) max dim 24 1.230 (31,24) (32,04) 1.260 0.310 (7,87) (7,37) 0.290 b 0.125 (3,18) min seating plane 0.010 (0,25) nom a 0.070 (1,78) max 24 1 0.015 (0,38) 0.021 (0,53) 0.020 (0,51) min 0.100 (2,54) m 0.010 (0,25) 0 15 notes: a. all linear dimensions are in inches (millimeters). b. this drawing is subject to change without notice.

mechanical data msso002e ? january 1995 ? revised december 2001 post office box 655303 ? dallas, texas 75265 db (r-pdso-g**) plastic small-outline 4040065 /e 12/01 28 pins shown gage plane 8,20 7,40 0,55 0,95 0,25 38 12,90 12,30 28 10,50 24 8,50 seating plane 9,90 7,90 30 10,50 9,90 0,38 5,60 5,00 15 0,22 14 a 28 1 20 16 6,50 6,50 14 0,05 min 5,90 5,90 dim a max a min pins ** 2,00 max 6,90 7,50 0,65 m 0,15 0 ? 8 0,10 0,09 0,25 notes: a. all linear dimensions are in millimeters. b. this drawing is subject to change without notice. c. body dimensions do not include mold flash or protrusion not to exceed 0,15. d. falls within jedec mo-150
important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all products are sold subject to ti?s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with ti?s standard warranty. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. ti assumes no liability for applications assistance or customer product design. customers are responsible for their products and applications using ti components. to minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any ti patent right, copyright, mask work right, or other ti intellectual property right relating to any combination, machine, or process in which ti products or services are used. information published by ti regarding third-party products or services does not constitute a license from ti to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. reproduction of this information with alteration is an unfair and deceptive business practice. ti is not responsible or liable for such altered documentation. resale of ti products or services with statements different from or beyond the parameters stated by ti for that product or service voids all express and any implied warranties for the associated ti product or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. following are urls where you can obtain information on other texas instruments products and application solutions: products applications amplifiers amplifier.ti.com audio www.ti.com/audio data converters dataconverter.ti.com automotive www.ti.com/automotive dsp dsp.ti.com broadband www.ti.com/broadband interface interface.ti.com digital control www.ti.com/digitalcontrol logic logic.ti.com military www.ti.com/military power mgmt power.ti.com optical networking www.ti.com/opticalnetwork microcontrollers microcontroller.ti.com security www.ti.com/security low power wireless www.ti.com/lpw telephony www.ti.com/telephony video & imaging www.ti.com/video wireless www.ti.com/wireless mailing address: texas instruments post office box 655303 dallas, texas 75265 copyright ? 2006, texas instruments incorporated

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